application on epoxy resin
dbu has almost no curing reaction with epoxy resin in the range of room temperature to 40℃, but it can make epoxy resin gel in 15min when the temperature increases to 100℃. dbu is mainly used as a curing accelerator for epoxy resins used for encapsulation of integrated circuits and electronic components in epoxy resins.
the combination of dbu and linear phenolic resin is a light yellow solid, which changes the disadvantage that dbu is easy to be hydrolyzed under humid environment. therefore it consists of epoxy molding compound for ic encapsulation with good resistance to moisture heat and high pressure steaming.

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